Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. We VICCO provide the up-to-date TSOP package and testing solutions with full customized services. With full range testing and production inspection we deliver the TSOP package solution with high reliability and steady performance, it suits well for consumer electronic devices SSD range and USB based products.